Wafer & Dice Sales Processing Services
Performance, and production readiness at every stage of the wafer journey
Wafer & Dice Sales Processing Services
Unisem supports the increasing demand for wafer-level solutions, particularly for advanced packages that are not assembled in-house. Our Wafer Sales and Processing Services are engineered to meet the stringent quality and reliability standards of the semiconductor and automotive industries We offer a complete range of backend wafer processing services, including:
Mounting
Laser Grooving
Dicing
Automated Optical Inspection (AOI)
Packing into Shipper Boats
This turnkey solution enables our customers to receive fully processed, high-quality diced wafers, ready for downstream integration or direct shipment to their end customers—supporting applications across ADAS, EV power modules, industrial sensors, and consumer electronics.
Key Benefits:
Optimized for high-reliability applications
Automotive-grade process controls and traceability
Streamlined supply chain with reduced lead time
Scalable support from NPI to high-volume production
With Unisem, you gain a trusted partner committed to delivering precision, performance, and production readiness at every stage of the wafer journey.
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