UNISEM UAT
Establish Since 2006
Pioneering Advanced Wafer Bumping in Malaysia
Unisem Advanced Technologies Sdn Bhd (UAT) formerly known as Unisem-Advanpack Technologies Sdn Bhd is a leading provider of wafer bumping and advanced interconnect solutions. As one of Malaysia’s first independent specialists in this field, we have been setting industry benchmarks since 2006.
Operating from a 1,418-square-meter facility, UAT maintains Class 100 (1,248 -square meter), 1,000, and 10,000 cleanroom environments, enabling exceptional process control and contamination-free manufacturing
With the capability to process wafers up to 300mm, we offer a full suite of wafer bumping services engineered for precision, reliability, and high performance — Supporting a wide range of semiconductor applications across global markets.
Comprehensive Wafer Bumping & Redistribution Services
UAT provides industry-leading bumping and wafer-level processing for 150mm, 200mm and 300mm wafers, with cleanroom classifications of Class 100, 1,000, and 10,000. Our capabilities as following.
Gold Bumping
Reliable interconnects for wire bonding and flip-chip applications.
Electroplated Solder Bumping
Lead-free and eutectic solder solutions tailored to diverse requirements.
Electroplated Copper Pillar Bumping
High-density, high-performance interconnects for next-generation devices
Large Solder Bumping (Ball Drop)
Optimized for advanced package-on-package (PoP) and BGA applications
Passivation & Redistribution – Passivation using PI or PBO and bond pad redistribution for enhanced device functionality
In-House Photomask & Stencil Design – Faster turnaround and tighter process control through internal design capabilities.
Certified for Excellence
At Unisem Advanced Technologies (UAT), we uphold the highest global standards for quality, safety, and environmental responsibility. Our operations are fully compliant with rigorous industry requirements, backed by internationally recognized certifications as following.
Automotive Quality Management
IATF 16949:2016
Quality Management System
ISO 9001:2015
Environmental Management System
ISO 14001:2015
Occupational Health & Safety Management System
ISO 45001:2018
Responsible Business Alliance Compliance
RBA VAP
ESD Control
ANSI/ESD S20.20:2014
Certified Sony Green Partner
Driven by a legacy of technical excellence and innovation, UAT continues to advance the field of wafer-level packaging delivering scalable, high-performance interconnect solutions for tomorrow’s semiconductor technologies.
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