At Unisem, technology is more than a capability—it’s a strategic imperative. As semiconductor innovation accelerates, we continuously evolve to meet the rising complexity and pace of the industry. Through our forward-looking Technology Roadmap, we align R&D, capital investments, and engineering expertise to deliver solutions that anticipate market trends and customer needs.
Short- and medium-term targets aligned with megatrends—AI, EVs, 5G, and smart manufacturing
Sustain leadership in mature technologies (flip chip, SiP, MEMS) while scaling next-gen capabilities for tomorrow’s challenges
Allocate investments dynamically, prioritizing high-impact areas like EV infrastructure and cloud-ready systems
We partner with global industry leaders to co-create solutions that redefine possibilities. From advancing Industry 4.0 adoption to pioneering eco-conscious manufacturing, our alliances accelerate breakthroughs in:
EV power modules, sensor systems
High-density computing packages
Ultra-compact MEMS for wearables and AR/VR
We remain committed to expanding capacity and capabilities—especially in our Unisem Group operations—while incorporating Industry 4.0 automation to enhance productivity and reduce reliance on manual labour. This includes real-time data integration and smarter manufacturing processes across our new facilities.
To lead the semiconductor assembly and test industry through relentless innovation, operational excellence, and sustainable growth—enabling technologies that power the future.
We advance the world of semiconductors by pushing the limits of technology and capability.
Guided by our Technology Roadmap and strategic priorities, we develop high-performance, environmentally responsible packaging and test solutions tailored for cutting-edge applications—from AI and cloud computing to electric vehicles and advanced mobile devices.
Through continuous investment in R&D, equipment, and people, we deliver the agility, scalability, and precision our customers need to thrive in a fast-moving, high-stakes industry.
– Invest in next-gen capabilities (MEMS, SiP, WLCSP) and align R&D with trends like AI, EVs, and cloud infrastructure.
– Maintain leadership in mature technologies (flip chip, MEMS) while scaling innovations like tier-one smartphone microphone MEMS.
Develop eco-friendly processes and safer workplaces, minimizing environmental impact across operations.
Expand capacity in strategic hubs (e.g., Malaysia) with upgraded, energy-efficient equipment for high-volume, precision-driven production.
Leverage real-time WIP systems and data-driven upgrades to enhance productivity, yield, and time-to-market.
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