Welcome to Unisem Gopeng, our cutting-edge flagship facility engineered to accelerate your success in the ever-evolving electronics landscape. Purpose-built with the latest in automation and precision technologies, we’re raising the bar for quality, speed and innovation.
At Unisem Gopeng, innovation meets reliability. Partner with us to unlock new levels of speed, scale and sophistication in semiconductor packaging—and power the next wave of electronic breakthroughs.
At Unisem Gopeng, innovation meets reliability. Partner with us to unlock new levels of speed, scale and sophistication in semiconductor packaging—and power the next wave of electronic breakthroughs.
From advanced pick-and-place robots and high-throughput wire-bonding lines to fully automated optical inspection and environmental stress screening, every square foot of Unisem Gopeng is optimized for flawless yields and rapid turnaround.
Building on our proven QFN/MIS capabilities, Gopeng is a dedicated hub for Module and System-in-Package (SiP) solutions, with MEMS integration on the horizon. Whether you need high-density I/O, mixed-signal interconnects or next-generation sensor fusion, our lines adapt to your roadmap.
Nestled within a mature semiconductor supply-chain ecosystem and equipped with on-site warehousing and drop-shipment services, Unisem Gopeng delivers seamless logistics from prototype to production—and around the world.
Backed by a handpicked team of process engineers and quality specialists, we combine rigorous in-line testing with ISO-grade quality controls to ensure every device surpasses your toughest performance criteria.
Unisem Gopeng operates to the highest global standards—ensuring quality, safety, environmental responsibility, and ethical operations at every level. Key certifications include shown as following.
ISO 14001
ISO 9001
ANSI/ESD S20.20
ISO 45001
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