Our Milestone

wafer-service

2025

Unisem Gopeng IECQ QC080000:2017 - HSPM certified and Silver GreenRE Certification
UGP 1 (2)

2024

Unisem Gopeng Plant, Phase 1 completed
DCIM100MEDIADJI_0056.JPG

2023

Construction of Phase 1, Gopeng Plant
ChatGPT Image Apr 16, 2025, 12_55_28 AM

2022

Phase 1, Gopeng Plant ground breaking
Unisem Chengdu Phase 3 completed
WhatsApp Image 2025-04-07 at 8.35.08 PM

2021

Unisem Chengdu Phase 3 expansion
Ipoh1

2019

Offer Package Level EMI shielding 12" wafer bumping capability at UAT
freepik__a-green-computer-chip-with-two-leaves-growing-out-__9293

2014

1st RBA VAP Obtained Samsung ECO partner ANSI ESD S20.20 Certified
ChatGPT Image Apr 16, 2025, 01_54_38 AM

2012

Unisem expands WLCSP & Bumping capability
ChatGPT Image Apr 16, 2025, 12_55_28 AM

2011

Unisem Chengdu Phase 2 expansion and install wafer bump capability
WhatsApp Image 2025-04-07 at 8.35.09 PM

2006

Commenced Wafer Bump service at UAT, Launched Chengdu factory
freepik__the-style-is-candid-image-photography-with-natural__52292

1998

Listed on Kuala Lumpur Stock Exchange Mainboard
Unisem Ipoh

1992

Unisem started with Ipoh, Simpang Pulai Factory