Back
Home
About Unisem
Overview
Board of Directors
Management Team
Milestone
Mission & Vision
Awards
Operating Sites
Ipoh
Gopeng
ChengDu
UAT
Corporate Governance
Corporate Social Responsibility
Whistle Blowing
Tech R&D
Overview
Quality Assurance
Package Offering
Bumping Services
Test Services
Wafer Sales
Career & Programmes
Careers
Training & Development
Sustainability
Investor Relation
get in touch
Our
Milestone
2025
Unisem Gopeng IECQ QC080000:2017 - HSPM certified and Silver GreenRE Certification
2024
Unisem Gopeng Plant, Phase 1 completed
2023
Construction of Phase 1, Gopeng Plant
2022
Phase 1, Gopeng Plant ground breaking
Unisem Chengdu Phase 3 completed
2021
Unisem Chengdu Phase 3 expansion
2019
Offer Package Level EMI shielding 12" wafer bumping capability at UAT
2014
1st RBA VAP Obtained Samsung ECO partner ANSI ESD S20.20 Certified
2012
Unisem expands WLCSP & Bumping capability
2011
Unisem Chengdu Phase 2 expansion and install wafer bump capability
2006
Commenced Wafer Bump service at UAT, Launched Chengdu factory
1998
Listed on Kuala Lumpur Stock Exchange Mainboard
1992
Unisem started with Ipoh, Simpang Pulai Factory
Company
Overview
Vision & Mission
Board Of Directors
Management Team
Awards
Milestone
Sustainability
Contacts Us
Tech & Services
Overview
Quality Assurance
Package Offering
Bumping Services
Test Services
Wafer Sales
Corporate
Corporate Governance
Corporate Social Responsibility
Investor Relations
News & Announcement
Careers
Training & Development
Whistleblower
Operating Sites
UAT
Ipoh
Gopeng
Chengdu (China)
Copyright © 2016 – 2025 Unisem (M) Berhad 198901006009 (183314-V).
All Rights Reserved.
Facebook
Youtube
Linkedin
Website Design Powered By JYSOFT & jiehao_03