UNISEM CHENGDU
Establish Since July, 2006
Strategic Scale, Global Impact
As a cornerstone of the Unisem Group, Unisem Chengdu Co., Ltd. operates a 520,000-square-foot advanced semiconductor assembly and test facility in Chengdu, China, strategically positioned to serve high-growth markets across Asia and beyond. Since launching mass production in 2006, we’ve cultivated a workforce of 3000+ experts and pioneered cutting-edge manufacturing processes. With a dedicated 48m² expansion site for Phase 3 development, we are primed to amplify capacity, drive innovation, and deliver scalable solutions for tomorrow’s semiconductor demands.
Comprehensive Turnkey Solutions
Unisem Chengdu is your trusted partner for full turnkey semiconductor solutions, integrating advanced technologies with agile execution to accelerate time-to-market and optimize supply chains. The facility offers bumping services focused on 200mm wafers.
Advanced Packaging & Testing
Diverse Portfolio
Leadframe/substrate packages (QFP, QFN), leadless modules, MEMS, flip-chip, and wafer-level CSP.
Specialized Expertise
Precision testing for analog, mixed-signal, RF, and automotive-grade semiconductors.
Wafer-Level Innovation
200mm wafer bumping (copper pillar, solder bumps), pad redistribution, and re-passivation.
Seamless Integration
End-to-end services from wafer probing, backgrinding, and assembly to final test and global logistics coordination.
Customized drop-shipping to meet stringent JIT (Just-in-Time) requirements.
Unisem Chengdu Co., Ltd.
Powering Innovation in Global Semiconductor Ecosystem.
Quality-Driven, Globally Certified
Unisem Chengdu is deeply committed to operational excellence, sustainability, and customer satisfaction. The facility is certified to an extensive suite of international standards which as the following.
Automotive Quality Management
IATF 16949:2016
Quality Management System
ISO 9001:2015
Environmental Management System
ISO 14001:2015
Occupational Health & Safety Management System
ISO 45001:2018
Responsible Business Alliance Validated Audit Process
RBA VAP
ESD Control
ANSI/ESD S20.20:2014
Hazardous Substance Process Management
IECQ QC 080000:2017
Supply Chain Security
Global Security Verification (GSV)
Certified Sony Green Partner
Samsung Eco-Partner
Partnership with Unisem Chengdu
Engineered for the Future.
Trusted by the World.
At Unisem Chengdu, we transform silicon into solutions that redefine industries. Let’s collaborate to shape the next wave of semiconductor innovation—with precision, responsibility, and unmatched technical agility.
For Investors
A track record of scalable growth, operational excellence, and alignment with high-margin semiconductor sectors.
For Customers
One-stop expertise, IP protection, and rapid ramp-up for complex devices.
For Partners
Collaborative innovation, ESG-aligned practices, and shared success in global markets.
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