About Us

At Unisem, technology is more than a capability—it’s a strategic imperative. As semiconductor innovation accelerates, we continuously evolve to meet the rising complexity and pace of the industry. Through our forward-looking Technology Roadmap, we align R&D, capital investments, and engineering expertise to deliver solutions that anticipate market trends and customer needs.

Strategic Focus - Where Vision Meets Velocity

Technology
Roadmap Precision

Short- and medium-term targets aligned with megatrends—AI, EVs, 5G, and smart manufacturing

Balanced
Innovation

Sustain leadership in mature technologies (flip chip, SiP, MEMS) while scaling next-gen capabilities for tomorrow’s challenges

Resource
Agility

Allocate investments dynamically, prioritizing high-impact areas like EV infrastructure and cloud-ready systems

FY2024 - Milestones That Matter

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Market-Ready Investments

Directed resources toward EV and cloud computing infrastructure, enhancing operational efficiency and scalability
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Patent Powerhouse

Secured 31 patents to date, with RM8 million invested in R&D (1% of revenue) to fuel future-ready innovation
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R&D Excellence

Completed 3 projects, initiated 4 new collaborations (including co-development with customers), and qualified 9 new processes/materials for tailored solutions
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Tier-One Triumph

Launched mass production of cutting-edge MEMS microphones for a global smartphone giant, powered by proprietary assembly tech and advanced materials

Collaboration - Innovating with Giants

We partner with global industry leaders to co-create solutions that redefine possibilities. From advancing Industry 4.0 adoption to pioneering eco-conscious manufacturing, our alliances accelerate breakthroughs in:

Smart Mobility

EV power modules, sensor systems

Cloud Infrastructure

High-density computing packages

Consumer Tech

Ultra-compact MEMS for wearables and AR/VR

We remain committed to expanding capacity and capabilities—especially in our Unisem Group operations—while incorporating Industry 4.0 automation to enhance productivity and reduce reliance on manual labour. This includes real-time data integration and smarter manufacturing processes across our new facilities.

Our Vision

To lead the semiconductor assembly and test industry through relentless innovation, operational excellence, and sustainable growth—enabling technologies that power the future.

Our Mission

We advance the world of semiconductors by pushing the limits of technology and capability.
Guided by our Technology Roadmap and strategic priorities, we develop high-performance, environmentally responsible packaging and test solutions tailored for cutting-edge applications—from AI and cloud computing to electric vehicles and advanced mobile devices.

Through continuous investment in R&D, equipment, and people, we deliver the agility, scalability, and precision our customers need to thrive in a fast-moving, high-stakes industry.

Technological Agility

– Invest in next-gen capabilities (MEMS, SiP, WLCSP) and align R&D with trends like AI, EVs, and cloud infrastructure.

– Maintain leadership in mature technologies (flip chip, MEMS) while scaling innovations like tier-one smartphone microphone MEMS.

Sustainable Innovation

Develop eco-friendly processes and safer workplaces, minimizing environmental impact across operations.

Customer-Driven Scalability

Expand capacity in strategic hubs (e.g., Malaysia) with upgraded, energy-efficient equipment for high-volume, precision-driven production.

Operational Precision

Leverage real-time WIP systems and data-driven upgrades to enhance productivity, yield, and time-to-market.